Fotona peeling, fractional resurfacing, scar refinement
The erbium setting of the fotona laser can grind, evaporate the surface part of the skin. The precise setting of the penetration depth is unique. This allows us to modify, adjust the peeling from a very deep, to a gentle surface peeling. We can also use this treatment to remove scars. This is based on grinding the surface of the scar, and a specific benefit is the biostimulation of regenerative processes that soften and heal the skin.
Duration of the procedure: 30 min
Catalog number: S-116
